Microsystem technology platform attached to state key lab of transducer technology consisits of two parts : one is micro processing platform,which can provide oxidation diffusion,lithography,bonding,chemical deposition of thin films,metal coating,dry etching,chemical deposition of thin films,metal coating,dry etching,wet etching and other technical services;the other is microsystem packaging platform, which can complete the process of wafer thinning,cutting,single-chip  packaging and module assembly. The whole platform has 88 sets of advanced  large-and-middle-sized equipment,with the total value of 140 million yuan.It  can achieve the chip manufacturing,chip packaging,device testing,micro system integration and other complete sets of processes.