RESUME
Professor Jiachou Wang received his B.S. and M.S. degrees in mechanical engineering from Harbin University of Science and Technology, in 2002 and 2005, respectively, and the Ph.D. degree in mechanical and Electronic Engineering from Harbin Institute of Technology, Harbin, China, in 2008. He joint State Key Lab of Transducer Technology, Shanghai Institute of Micro System and Information Technology, Chinese Academy of Sciences, Shanghai, CHINA, as an assistant professor and associate professor in 2009 and 2011, respectively, and became a professor in 2018. Dr. Wang’ researches focus on MEMS sensor and Micro/Nano fabrication technologies. He has published more than 30 peer-reviewed papers and obtained more than 15 authorized China invention patents.
Research Experience
1. 2018-Present, Professor, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, CHINA
2. 2011-12.2017, Associate Professor, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, CHINA
3. 2009-12.2010, Assistant Professor, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, CHINA
EDUCATION
Ph.D. - Mechanical Electronic Engineering, State Key Laboratory of Robotics and System, Harbin Institute of Technology, Harbin, CHINA (Mar. 2005-Jul.2008)
M.S. - Mechanical Design and theory, Harbin University of Science and Technology, Harbin, CHINA (Sep. 2002-Mar.2005)
B.S. - Mechanical Design and Manufacturing, Harbin University of Science and Technology, Harbin, CHINA (Sep.1998-Mar.2002)
MAJOR PROJECTS
I. National Natural Science Foundation of China (Grant No. 61674160, 1/2017-12/2020,￥650,000), TUB (Thin-film Under Bulk) composite-structure formation mechanism and its application in high-performance MEMS devices, project leader.
SELECTED PUBLICATIONS
1. Dan Xue, Jiachou Wang*, Xinxin Li, “A Front-Side Microfabricated Thermoresistive Gas Flow Sensor for High-Performance, Low-Cost and High-Yield Volume Production, ” Micromachines, vol.205, no.11, 2020, doi: 10.3390/mil1020205.
2. Dan Xue, Fang Song, Jiachou Wang*, Xinxin Li, “Single-Side Fabricated p？Si/Al Thermopile-Based Gas Flow Sensor for IC-Foundry-Compatible, High-Yield, and Low-Cost Volume Manufacturing, ” IEEE Transactions on Electron Devices, vol.66, no.1, pp.821-824, 2019.
3. Hongshou Zhou, Jiachou Wang and Xinxin Li, “High-Performance low-range differential pressure sensors formed with a thin-film under bulk micromachining technology,” IEEE Journal of Microelectromechanical Systems, vol. 26, no.4, pp. 879-885, Aug. 2017.
4. Hongshou Zhou, Jiachou Wang, Fang Chen, et al, “Monolithically integrated tri-axis shock accelerometers with MHz-level high resonant-frequency,” J. Micromech. Microeng., 27(2017)075009.
5. Feng Yu, Jiachou Wang, Pengcheng Xu, and Xinxin Li, “A tri-beam dog-bone resonant sensor with high-Q in liquid for disposable test-strip detection of analyte droplet,” IEEE Journal of Microelectromechanical Systems, vol. 25, no.2, pp. 244-251, April. 2016.
6. Jiachou Wang and Xinxin Li, “Single-side Fabrication of Multi-Level 3D Micro Structures for Monolithic Dual-Sensors,” IEEE Journal of Microelectromechanical Systems, vol. 24, no. 3, pp. 531-533, 2015.
7. Fang Song and Jiachou Wang*, “A single-side microcavity-diaphragm-channel one-step formation method for low-cost and high-yield volume production of micro flow sensors,” Microelectronic Engineering, vol. 139, no.18, pp. 1-6, 2015
8. Jiachou Wang and Xinxin Li, “A dual-unit pressure sensor for on-chip self-compensation of zero-point temperature drift,” J. Micromech. Microeng., vol.24, no.8, pp. 1-10, 2014.
9. Jiachou Wang and Xinxin Li, “Package-friendly piezoresistive pressure with on-chip integrated packaging-stress-suppressed suspension (PS3) technology,” J. Micromech. Microeng., vol.23, no.4, pp. 1-6, 2013.
10. Jiachou Wang, Xiaoyuan Xia and Xinxin Li, “Monolithic Integration of Pressure plus Acceleration Composite TPMS Sensors with a Single-sided Micromachining Technology,” IEEE Journal of Microelectromechanical Systems, vol. 21, no. 2, pp. 284-293, 2012.
11. Jiedan Liu, Jiachou Wang and Xinxin Li, “Fully Front-side Bulk-micromachined Single-chip Micro Flow-sensors for Bare-chip SMT (Surface Mounting Technology) Packaging,” J. Micromech. Microeng., vol.22, no.3, pp. 1-9, 2012.
12. Jiachou Wang and Xinxin Li, “Single-Side Fabricated Pressure Sensors for IC-Foundry Compatible, High-Yield, and Low-Cost Volume Production,” IEEE Electron Device Letters, vol. 32, no. 7, pp. 979-981, July. 2011.
