RESUME
Professor Fei Feng received his bachelor’s degree from the Department of Physics of Hubei Normal University in July 1994, master’s degree from Changchun University of Science and Technology in March, 2001 and doctor’s degree from Shanghai Institute of Microsystem and Information technology(SIMIT), CAS, in June, 2004.From August 1994 to August 1998, he was a teacher in Herong Senior Middle School, Dangyang, Hubei Province. He served as the assistant professor and associate professor of State Key Lab of Transducer Technology, SIMIT, CAS from July 2004 to December 2005, and from January 2006 to December 2011, respectively. He has been a professor of State Key Lab of Transducer Technology, SIMIT, CAS since January, 2012. He was a visiting scholar at Berkeley Sensors & Actuator Center, the University of California at Berkeley from May 2012 to May 2013. His major fields include Micro Electro Mechanical System （MEMS/NEMS）and Micro-/Nano-Sensor. His research interests include: Micro-mechanical uncooled infrared imaging; Micro-gas chromatography based MEMS; UV detector and the thermoelectric effect of nano-materials. The programs and projects he completed or is undertaking include the state 863 and 973 programs, the projects of the National Natural Science Foundation of China, Shanghai Commission of Science and Technology and CAS, etc.
HONORS AND AWARDED RESEARCH FUNDS
Science and Technology Commission of Shanghai Municipality (Grant No. 14DZ1105102, 11/2014-10/2017, ￥2,000,000), Research and development of MEMS core components for portable gas detection system based on gas chromatography, project leader.
National Natural Science Foundation of China (Grant No.91323304-3, 7/2016-12/2017,￥500,000), Principle and method of cross scale nano batch manufacturing, sub project leader.
National Natural Science Foundation of China (Grant No. 61172151, 1/2012-12/2015,￥620,000), Study on MEMS optically readable uncooled infrared imaging array based on the thermo-optic effect, project leader.
National High Technology Research and Development Program of China (Grant No. 2009AA04Z317, 4/2009-4/2012, ￥760,000), Study on micromachining optically readable uncooled infrared detector, project leader.
National Natural Science Foundation of China (Grant No. 60876081, 1/2009-12/2011,￥320,000), Study on silicon nanowires with high thermoelectric figure of merit, project leader.
National Natural Science Foundation of China (Grant No. 60407013, 1/2005-12/2007,￥230,000), Study on optically readable uncooled thermal imaging technology based on Fabry-Perot interference principle, project leader.
Shanghai-Applied Materials Research and Development Fund (Grant No. 06SA04,7/2006-6/2008, ￥180,000 ), Study on optically readable uncooled infrared detector array technology based on MEMS, project leader.
First Class Award for Excellent papers-Micromachined Optically Readable Thermal Imaging System, The 16th Chinese symposium on infrared science and technology, October 24-29, 2003, Wuhan, China.
RESEARCH EXPERIENCE
2012-Present, Professor
State Key Laboratories of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China
2012-2013, Visiting Scholar
Berkeley Sensors & Actuator Center, the University of California at Berkeley, CA, USA
2006-2011, Associate Professor
State Key Laboratories of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China
2004 –2005, Assistant Professor
State Key Laboratories of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China
EDUCATION
Ph.D.-Electronic science and technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China (June, 2004)
M.E.-Electronic science and technology, Changchun University of Science and Technology, Changchun, Jilin Province, China (March, 2001)
B.S.-Physics, Hubei normal university, Huangshi, Hubei Province, China (July, 1994)
INVITED TALKS
2017 “Micro gas chromatograph based on MEMS”, The 21th national symposium and exhibition on chromatography of China, Lanzhou, Gansu, China.
2016 “MEMS manufacturing technology”, Advanced training course for MEMS, Wuxi, Jiangsu, China.
2013 “Uncooled infrared imaging detector based on MEMS”, Huazhong University of Science and Technology, Wuhan, China.
SELECTED PUBLICATIONS
1)Wenbin You, Fei Feng*, Zhenyin Yu, Xiaohong Ge, Ming Liu and Xinxin Li, Research of temperature controlling module of micro thermal conductivity detector, Transducer and Microsystem Technologies, Vol.36,No.2,2017:11-13. (in chinese)
2)Lei Hou, Fei Feng*, Wenbin You, Pengcheng Xu, Fan Luo, Bowen Tian, Haimei Zhou, Xinxin Li,Effect of pore size of stationary phase on the seperation performance of chip-based gas chromatography columns, IEEE Transducers 2017, June 18 - 22, 2017, Kaohsiung, Taiwan, China.
3)Fei Feng*, Bowen Tian, Lei Hou, Zhenyin Yu, Haimei Zhou, Xiaohong Ge, Xinxin Li, High sensitive micro thermal conductivity detector with sandwich structure, IEEE Transducers 2017, June 18 - 22, 2017, Kaohsiung, Taiwan, China.
4)Wei Li, Zao Ni, Fang Chen, Jiachou Wang, Fei Feng, Xinxin Li, Tiny-sized ultra-sensitive infrared-thermopile fabricated with a single-sided bulk-silicon micromachining technique, IEEE MEMS 2017, January 22-26, 2017, Las Vegas, USA.
5)Fan Luo, Fei Feng*, Lei Hou, Wenbin You, Pengcheng Xu, Xinxin Li, Xiaohong Ge, Yanhong Wu.The exploration of mesoporous silica as a stationary phase support for semi-packed micro-fabricated gas chromatographic(GC) column, IEEE MEMS 2017, January 22-26, 2017, Las Vegas, USA.
6)Bowen Tian, Fei Feng*, Lei Hou, Fan Luo, Xinxin Li, Xiaohong Ge, Yanhong Wu. Research on micro-fabricated gas chromatographic columns with embedded elliptic cylindrical posts, IEEE MEMS 2017, January 22-26, 2017, Las Vegas, USA.
7)Fei Feng*, Yunsheng Zhang, Fan Luo, Xudong Wei, Xiaohong Ge, Yuelin Wang, Xinxin Li, MEMS based vacuum packaging method of optically readable infrared focal plane array, Microsystem technologies,2016: DOI 10.1007/s00542-016-3036-7.
8)Huihui Zhu, Fei Feng*, Yuelin Wang, Xinxin Li. Noise analysis and structural optimal design of diode microbolometer uncooled IRFPAs，Journal of infrared and millimeter waves, 2015: DOI:10.11972/j.issn.1001-9014.2015.06.002.
9)Fei Feng*, Yunsheng Zhang, Xiaohong Ge, Xudong Wei, Yuelin Wang, Xinxin Li. An uncooled optically readable infrared focal plane array, IEEE Transducers 2015 , June 21-25, 2015, Anchorage, Alaska, USA.
10)Yunsheng Zhang, Fei Feng*, Xudong Wei, Xiaohong Ge, Yuelin Wang, Vacuum packaging research for optically readable infrared FPA, Transducer and Microsystem Technologies, Vol.34,No.2,2015:44-46. (in chinese)
11)Kaiyuan Yao, Chen Yang, Xining Zang, Fei Feng and Liwei Lin. Carbon SP2-SP3 Technology: Graphene-on-Diamond Thin Film UV Detector, IEEE MEMS 2014, January 26-30, 2014, San Francisco, California, USA.
12)Xiao Yu, Yanxiang Liu, Hong Zhou, Yi Wang, Tie Li, Xiuli Gao, Fei Feng, and Yuelin Wang, Thermal Matching Designed CMOS MEMS-Based Thermoelectric Generator for Naturally Cooling Condition, Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, DTIP, 2013.
13)Xiao Yu, Yuchen Wang, Yanxiang Liu, Tie Li, Hong Zhou, Xiuli Gao, Fei Feng, Tomi Roinila and Yuelin Wang.CMOS MEMS-based thermoelectric generator with an efficient heat dissipation path, Journal of Micromechanics and Microengineering, 2012(22): 105011.
14)Jianqin Huo, Fei Feng*, Wenrong Wang, Xiaohong Ge, Tie Li, Yuelin Wang, Research on measurement device for temperature difference in the micro-meter scale, Transducer and Microsystem Technologies, Vol.31,No.11,2012:47-50. (in chinese)
15)Weifeng Xia, Fei Feng*, Quan Wang, Bin Xiong, Xiaohong Ge, Influence of pretreatment to silicon surface roughness in KOH anisotropic silicon etching, Semiconductor Optoelectronics , Vol. 31, No4, 2010:579-582. (in chinese)
16)X. Yan, F. Feng*, Y.L. Wang. Optical analysis of thermo-optic infrared focal plane arrays, International Symposium on Photoelectronic Detection and Imaging, Beijing, Jun 17-19, 2009, Proc. of SPIE Vol. 7383 73834S-1-73834S-6.
17)X. Yan, F. Feng*, Y.L. Wang. Thermo-optic infrared focal plane arrays, IEEE Transducers 2009. Denver, Jun 21-25, 2009:1361-1364.
18)X. Yan, F. Feng*, G.L. Yang and Y.L. Wang. Smooth Surface Morphology of Hydrogenated Amorphous Silicon Film Prepared by Plasma Enhanced Chemical Vapor Deposition, Plasma Sciences and Technologies, Vol.11, No.5, Oct. 2009:569-575.
19)X. Yan, F. Feng*, S. Li, Y.L. Wang. Design and analysis of the film assembly of thermo-optic infrared focal plane arrays, Microsystem Technologies, (2009) 15: 907-911.
20)X. Yan, F. Feng*, G.L. Yang, Y.L. Wang. Investigation of the extinction coefficient of PECVD hydrogenated amorphous silicon nitride films, Journal of Micromechanics and Microengineering, 2008(18): 085001.
21)Feng Fei*, Yang Guangli, Xiong Bin, Wang Yuelin. A New Method for Protection of Anchors in Releasing Microstructure by Using XeF2 Etching Process. IEEE Transducers 2007 Lyon, France, June10-14,2007: 559～562.
22)Yang Guangli, F. Feng*, Xiong Bin, Wang Yuelin. Design of an uncooled optically readable infrared imaging array device. Semiconductor optoelectronics, 2007,28(3):327-330. (in chinese)
23)Yang Guangli, F. Feng*, Xiong Bin, Wang Yuelin. Effects of Mechanical Character of an Micro-mechanical Optically Readable Infrared Imaging Array Device on its Performance. Optics and precision engineering, 2007,15(5):609-705. (in chinese)
24)Feng Fei, Jiao Jiwei, Xiong Bin and Wang Yuelin. Optical and Thermal Design for Optically Readable Thermal Imaging Focal Plane Array. Acta Optica Sinica, Vol.24(11), 2004, pp.1543~1546. (in chinese)
25)Feng Fei, Jiao Jiwei, Xiong Bin and Wang Yuelin. Design and Fabrication of Optically Readable Infrared Thermal Imaging Device Based on Fabry-Perot Micro-Cavity Array. Acta Optica Sinica, Vol.24(10), 2004, pp.1375~1380. (in chinese)
26)Feng Fei, Jiao Jiwei, Xiong Bin and Wang Yuelin. Design and Fabrication of a Novel Optically Readable Thermal Imaging System Based on MEMS Technology. Journal of Infrared and Millimeter Waves, Vol.23(2), 2004, pp.125~130. (in chinese)
27)Feng Fei, Jiao Jiwei, Xiong Bin and Wang Yuelin. Optimal Design and ANSYS Simulation for Optically Readable Thermal Imaging Chip. Chinese Journal of Semiconductors, Vol.25(5), 2004, pp.552~556. (in chinese)
28)Feng Fei, Jiao Jiwei, Xiong Bin and Wang Yuelin. Study of All-Light Thermal Imaging Chip and System Based on MEMS Technology. Chinese Journal of Semiconductors, Vol.25(4)，2004,pp.477~480. (in chinese)
29)Feng Fei, Xiong Bin, Jiao Jiwei and Wang Yuelin. A Novel Light Modulating Thermal Imaging Device. STC 2003, November 16-18, 2003, Beijing, China. pp.139~144.(in chinese)
30)Feng Fei, Jiao Jiwei, Xiong Bin and Wang Yuelin. Micromachined Optically Readable Thermal Imaging System. The 16th Chinese symposium on infrared science and technology, October 24-29, 2003, Wuhan, China. pp.387-389. (in Chinese, First Class Award for Excellent papers )
31)Feng Fei, Jiao Jiwei, Xiong Bin and Wang Yuelin. A Novel All-Light Optically Readable Thermal Imaging Sensor Based on MEMS Technology. The second IEEE international conference on sensors. Toronto, Canada.October 22-24, 2003: 513~516.
