Professor Heng Yang received the B.Sc. and Ph.D. degrees in electronic engineering from the department of Electronics Engineering, Fudan University, Shanghai, China, in 1995 and 2001, respectively. He worked as a post-doctor in the Electronic Instrumentation Laboratory, Delft University of Technology, the Netherlands, from 2001 to 2003. He joint Shanghai Institute of Micro System and Information Technology, Shanghai, China, as an associate professor in 2003 and became a professor in 2006. Dr. Yang’s research interests include the MEMS resonators, resonant sensors and Micro/Nano fabrication technologies.
Professor, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, 2006-present
Associate Professor, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, 2003-2006
Post doc, Delft University of Technology, 2001-2003
B.S., Electronic Engineering, 1995, Fudan University
Ph.D., Electronic Engineering, 2001, Fudan University
The status and developing trends of silicon MEMS technology and the activities in SIMIT, 2013 Hangzhou International Sensor Technology and Application of Internet of Things Summit, Oct. 23, 2013.
MEMS and Microsystem Activities in SIMIT, ISIM 2012, Tsukuba, Japan, Feb. 13, 2012
1)Weilong You, Lei Zhang, Xiaofei Wang, Wenshan Wei, Weifeng Xia, Heng Yang, Xinxin Li, Electrostatic tuning in linear regime for 25.9‑MHz micromechanical resonator with 120‑nm capacitive gap， Microsystem Technologies, DOI 10.1007/s00542-016-3136-4, 2016.
2)Chuanguo Dou, Heng Yang*, Yanhong Wu, Xinxin Li, Transferring stress and temperature sensors for stress measurement of wafer level packaging, Microsyst. Technology, DOI 10.1007/s00542-016-2902-7, 2016
3)Weilong You, Lei Zhang, Xiaofei Wang, Wenshan Wei, Weifeng Xia, Heng Yang*, Xinxin Li, Fabrication of high aspect ratio self‑aligned stepped polysilicon electrode for single‑crystal silicon microstructure, Microsyst. Technology, DOI 10.1007/s00542-015-2755-5, 2015
4)Wenshan Wei, Weilong You, Chuanguo Dou, Xiaofei Wang, Heng Yang*, Symmetrical design in piezoresistive sensing for micromechanical resonator, Microsyst. Technology, Vol.22, 2015, pp.811-816
5)Wenshan Wei, Weilong You, Wei Zhao, Zhengyin Yu, Jun Pang, Heng Yang*, A novel approach for MEMS with galvanic protection on SOI wafer, Microsyst. Technology, Vol.21, 2014, pp.1959-1965
6)Haitao Cheng, Heng Yang*, XinXin Li, Yuelin Wang, Field-effect piezoresistors for vibration detection of nanobeams by using monolithically integrated MOS capacitors, J. Micromech. Microeng. 23 (2013) 025011
7)Zi Yang Wu, Heng Yang, Chuan Guo Dou, Yan Hong Wu, Xin Xin Li, Yue Lin Wang，Suspended Photoresist Thin Film for Fabrication of Through Silicon Vias，IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. 1, NO. 9, 2011，pp.1345-1349.
8)Zi Yang Wu, Heng Yang*, Xin Xin Li and Yue Lin Wang, Self-assembly and transfer of photoresist suspended over trenches for microbeam fabrication in MEMS, J. Micromech. Microeng. 20 (2010) 115014.
9)M. Bao, H. Yang, Squeeze film air damping in MEMS, Sensors and Actuators, A136, 2007, pp.3-27.
10)M. Bao, H. Yang, Y. Sun, P. J. French. Modified Reynolds' equation and analytical analysis of squeeze-film air damping of perforated structures. Journal of Micromechanics and Microengineering, Vol.13, 2003, pp.795-800.
11)M. Bao, H. Yang, Y. Sun, Y. Wang. Squeeze-film air damping of thick hole-plate. Sensors and Actuators, A108, 2003, pp.212-217.
12)H. Yang, M. Bao, H. Yin, S. Shen. A novel bulk micromachined gyroscope based on a rectangular beam-mass structure. Sensors and Actuators, A96, 2002, pp.145-151.
13)H. Yang, M. Bao, H. Yin, S. Shen. Two-dimensional excitation operation mode and phase detection scheme for vibratory gyroscopes. J. Micromech. Microeng., Vol. 12, 2002, pp.193-197.
14)M. Bao, H. Yang, H. Yin, S. Shen. Energy transfer model for squeeze-film air damping in low vacuum. J. Micromech. Microeng., Vol. 12, 2002, pp.341-346.
15)H. Yang, M. Bao, S. Shen, et al. A novel technique for measuring etch rate distribution of Si. Sensors and Actuators, A79, 2000, pp.136-140.
16)M. Bao, H. Yang, H. Yin, S. Shen. Effects of electrostatic forces generated by the driving signal on capacitive sensing devices. Sensors and Actuators, A84, 2000, pp.213-219.
