Dr. Tiangui You received his B.S. and M.S. degree from Northwest University in 2009 and 2012, respectively. From 2012 to 2016, he pursued his Ph.D. degree at Chemnitz University of Technology in Germany, and was conferred on PH.D. degree in Nov. 2016. From Dec. 2016 to Dec. 2018, he was a Research Assistant at Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences (SIMIT), and from 2019 to present, he has served as a Research Associate. He was selected as the Yong Elite Scientists Sponsorship Program by CAST and Shanghai Pujiang Talent in 2017. His current researches focus on heterogeneous integration materials and devices, such as III-V compound semiconductor on Insulator (III-VOI), wide bandgap semiconductor on Insulator. He has published more than 40 peer-reviewed papers. As a principle investigator or key member, he has participated in more than 10 research projects from NSFC, MOST, etc.
EDUCATION
B. S. Electronic Science and Technology, 2009, Northwest University
M. S. Microelectronics and Solid-state Electronics, 2012, Northwest University
Ph.D. Material System for Nanoelectronics, 2016, Chemnitz University of Technology, Germany
RESEARCH EXPERIENCE
Associate Professor, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, 2019-Present
Assistant Professor, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, 2016-2018
Guest Scientist, IFW Dresden, 2012- 2016
Guest Scientist, Helmholtz Zentrum Dresden Rossendorf (HZDR), 2012-2015
HONORS AND AWARDED RESEARCH FUNDS
2017 Shanghai Pujiang Talent
2017 Yong Elite Scientists Sponsorship Program by CAST
2018-2020 NSFC "Ion beam fabrication of single-crystalline ZnO thin films and engineering of resistive switching by ion implantation "
2018-2021 National Key R&D Project "Wafer-scale integration of high performance thin film with Si-based IC"
2017-2022 Chinese Academy of Sciences strategic pilot technology special "XOI heterogeneous integration materials for the post-Moore era"
SELECTED PUBLICATIONS
1. Wenhui Xu#, Yibo Wang#, Tiangui You#, Xin Ou*, Genquan Han*, Haodong Hu,Shibin Zhang, Fengwen Mu, Tadatomo Suga, Yuhao Zhang, Yue Hao, Xi Wang, First Demonstration of Waferscale Heterogeneous Integration of Ga2O3 MOSFETs on SiC and Si Substrates by Ion-Cutting Process, International Electron Devices Meeting (IEDM), San Francisco, USA, 2019
2. Tiangui You*, Yao Shuai, Wenbo Luo, Nan Du, Danilo Buerger, Ilona Skorupa, Rene Huebner, Stephan Henker, Christian Mayr, Rene Schueffny, Thomas Mikolajick, Oliver G. Schmidt, Heidemarie Schmidt, Exploiting Memristive BiFeO3 Bilayer Structures for Compact Sequential Logics, Advanced Functional Materials, 2014, 24(22): 3357-3365.
3. Lin Jiajie#, You Tiangui#, Wang Mao, Huang Kai, Zhang Shibin, Jia Qi, Zhou Min, Yu Wenjie, Zhou Shengqiang, Wang Xi, Efficient ion-slicing of InP thin film for Si-based hetero-integration, Nanotechnology, 2018, 29(50): 0-504002.
4. Tiangui You#, Kai Huang#, Xiaomeng Zhao, Ailun Yi, Chen Chen, Wei Ren, Tingting Jin, Jiajie Lin, Yao Shuai, Wenbo Luo, Min Zhou, Wenjie Yu, Xin Ou*, Engineering of self-rectifying filamentary resistive switching in LiNbO3 single crystalline thin film via strain doping, Scientific Reports, 2019, 9(1): 0-19134.
5. Tiangui You*, Laveen Prabhu Selvaraj, Huizhong Zeng, Wenbo Luo, Nan Du, Danilo Buerger, Ilona Skorupa, Slawomir Prucnal, Alexander Lawerenz, Thomas Mikolajick, Oliver G. Schmidt, Heidemarie Schmidt*, An Energy-Efficient, BiFeO3-Coated Capacitive Switch with Integrated Memory and Demodulation Functions, Advanced Electronic Materials, 2016, 2(3): 1500352.
